Cooling device

ABSTRACT

A heat-transferring member is mounted on one side of a circuit board. A heat sink is arranged farther away from the circuit board than the heat-transferring member in the thickness direction of the circuit board. The heat sink has a plurality of fins each extending in the direction of the circuit board and separated from each other by a space. Also, the heat sink includes a support portion extending in the direction of the plurality of fins and supporting the plurality of fins. A plurality of heat pipes is connected to the heat-transferring member and separated from each other by a space, each extending in the thickness direction of the circuit board and connecting to the support portion.

REFERENCE TO RELATED APPLICATIONS

The Present Disclosure claims priority to prior-filed Japanese PatentApplication No. 2012-094163, entitled “Cooling Device,” filed on 17 Apr.2012 with the Japanese Patent Office. The content of the aforementionedPatent Application is incorporated in its entirety herein.

BACKGROUND OF THE PRESENT DISCLOSURE

The Present Disclosure relates, generally, to a cooling device includinga heat sink.

A cooling device has been disclosed in Japanese Patent Application No.2008-134115, which is used to radiate the heat of a heat-generating bodyin an electronic device. In this cooling device, a plurality ofoverlapping heat sinks (comb-shaped fins in the '115 Application) arearranged, and these are connected by a column-shaped base pin whichtransfers the heat.

In the '115 Application, a plurality of fins extend radially from asingle base pin in each heat sink. Because it is difficult to increasethe number of base pins using this structure, it is difficult to improvethe heat transfer efficiency from the heat-generating body to the heatsinks

SUMMARY OF THE PRESENT DISCLOSURE

A purpose of the Present Disclosure is to provide a cooling device ableto improve the efficiency with which heat is transferred from aheat-generating body to a heat sink.

In the cooling device of the Present Disclosure, a heat-transferringmember is mounted on one side of a panel-shaped heat-generating body. Aheat sink is arranged farther away from the heat-generating body thanthe heat-transferring member in the thickness direction of theheat-generating body. The heat sink includes a plurality of finsextending in the direction of the heat-generating body and separatedfrom each other by a space, and a support portion extending in thedirection of the fins, and connecting to and supporting the fins. Aplurality of heat-transferring columns is connected to theheat-transferring member and separated from each other by a space, withthe heat-transferring columns each extending in the thickness directionof the heat-generating body and connecting to the support portion. Inthis way, the efficiency with which heat is transferred from aheat-generating body to a heat sink can be improved.

In one aspect of the Present Disclosure, the cooling may furthercomprise a plurality of heat sinks arranged in the thickness directionof the heat-generating body with each functioning as a heat sink. Inthis way, the cooling performance of the cooling device can be improved.

In one aspect of the Present Disclosure, each of the plurality of heatsinks may have the same shape. In this way, the manufacturingproductivity of the cooling device can be improved.

In one aspect of the Present Disclosure, each of the plurality of heatsinks may be offset in the circumferential direction with respect to theadjacent heat sinks and centered on the centerline of theheat-generating body in the thickness direction. In this way, the airreceiving heat from the heat-generating body in each portion of the heatsinks may be discharged more readily.

In one aspect of the Present Disclosure, the support portion for each ofthe plurality of heat sinks may include a first extended portionextending in the direction of the heat-generating body and a secondextended portion extending in a direction intersecting the direction ofextension of the first extended portion. Also, each of the plurality ofheat sinks may include, as the plurality of fins, a plurality of finsprojecting from the first extended portion, and a plurality of finsprojecting from the second extended portion. In this way, the coolingperformance of the cooling device can be improved.

In one aspect of the Present Disclosure, the support portion for each ofthe plurality of heat sinks may include, as the second extended portion,at least two extended portions arranged symmetrically with respect tothe centerline of the first extended portion. In this way, the coolingperformance of the cooling device can be improved.

In one aspect of the Present Disclosure, the plurality ofheat-transferring columns may include at least three heat-transferringcolumns, the support portion may include at least three connectingportions connected to at least three heat-transferring columns, and atleast three connecting portions may be arranged at equal intervals inthe circumferential direction centered on the centerline of theheat-generating body in the thickness direction. In a structure in whicha plurality of heat sinks are offset in the circumferential direction,each of the heat-transferring columns can be connected to all of theheat sinks

In one aspect of the Present Disclosure, each of the plurality of heatsinks may include a first half body having a support portion and aplurality of fins, and a second half body having a support portion and aplurality of fins. Here, the first half body and the second half bodymay be arranged symmetrically with respect to a straight line runningalong the heat-generating body. This allows the size of each heat sinkto be increased. As a result, the cooling performance of the coolingdevice can be improved.

In one aspect of the Present Disclosure, an air passage may be formedbetween the first half body and the second half body, and the airpassage may extend radially from the centerline running through theheat-generating body in the thickness direction and be connected to theouter side of the plurality of heat sinks. In this way, the air can besent through an air passage between the first half body and the secondhalf body, which further improves cooling performance.

In one aspect of the Present Disclosure, the plurality of fins in thefirst half body may extend in the direction of the second half body, theplurality of fins in the second half body may extend in the direction ofthe first half body, and the air passage may be formed between theplurality of fins of the first half body and the plurality of fins ofthe second half body. In this way, the air can be sent to the finsthrough the air passage between the first half body and the second halfbody, which further improves cooling performance.

BRIEF DESCRIPTION OF THE FIGURES

The organization and manner of the structure and operation of thePresent Disclosure, together with further objects and advantagesthereof, may best be understood by reference to the following DetailedDescription, taken in connection with the accompanying Figures, whereinlike reference numerals identify like elements, and in which:

FIG. 1 is a perspective view of the cooling device of the PresentDisclosure;

FIG. 2 is a perspective view of the cooling device of FIG. 1, where asection of the heat sink half body has been removed for ease inviewability;

FIG. 3 is a side view of the lighting device containing the coolingdevice of FIG. 1;

FIG. 4 is a top view of the heat sink constituting the cooling device ofFIG. 1;

FIG. 5 is a bottom view of the cooling device of FIG. 1;

FIG. 6 is a perspective view of a heat sink of the Present Disclosure,in which a plurality of heat sinks are arranged in the thicknessdirection of the circuit board; and

FIG. 7 is a top view of the heat sinks shown in FIG. 6.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

While the Present Disclosure may be susceptible to embodiment indifferent forms, there is shown in the Figures, and will be describedherein in detail, specific embodiments, with the understanding that thePresent Disclosure is to be considered an exemplification of theprinciples of the Present Disclosure, and is not intended to limit thePresent Disclosure to that as illustrated.

As such, references to a feature or aspect are intended to describe afeature or aspect of an example of the Present Disclosure, not to implythat every embodiment thereof must have the described feature or aspect.Furthermore, it should be noted that the description illustrates anumber of features. While certain features have been combined togetherto illustrate potential system designs, those features may also be usedin other combinations not expressly disclosed. Thus, the depictedcombinations are not intended to be limiting, unless otherwise noted.

In the embodiments illustrated in the Figures, representations ofdirections such as up, down, left, right, front and rear, used forexplaining the structure and movement of the various elements of thePresent Disclosure, are not absolute, but relative. Theserepresentations are appropriate when the elements are in the positionshown in the Figures. If the description of the position of the elementschanges, however, these representations are to be changed accordingly.

Referring to the Figures, and, specifically, as shown in FIG. 5, thecooling device 1 has a heat-transferring member 20 in the bottomportion. In this example, the heat-transferring member 20 has aplurality of heat-dissipating plates 21. In this example, fourheat-dissipating plates 21 are arranged on the same plane, and togetherconstitute a rectangular heat-transferring member 20. Theheat-dissipating plates of the heat-transferring member 20 do not haveto be divided into four heat-dissipating plates 21. Theheat-transferring member 20 may have any number of heat-dissipatingplates corresponding to the size of the four heat-dissipating plates 21.The heat-dissipating plates 21 can be metal plates made of a thermallyconductive metal. Coolant passages may also be formed so that coolantmay circulate inside these containers.

The heat-transferring member 20 may be mounted on one side of apanel-shaped heat-generating body such as an integrated circuit, aprinted circuit board on which integrated circuits have been mounted, anIC chip, or an active/passive element. In the example explained here andshown in FIG. 3, the heat-generating body is a circuit board 90, and theheat-transferring member 20 is mounted on one side of the circuit board90. A plurality of electronic components are mounted on the other sideof the circuit board 90. The cooling device 1 in this example is adevice used in a lighting device 100. Here, a plurality of LightEmitting Diodes (LEDs) 91 are mounted on the circuit board 90. As shownin FIG. 5, the LEDs 91 are arranged in a grid-like pattern and arepositioned in the central portion of the heat-transferring member 20.The heat from the LEDs 91 is dissipated by the heat-dissipating plates21 in the entire heat-transferring member 20. In the lighting device 100shown in FIG. 3, the light from the LEDs 91 is directed downward. Theelectronic components are not limited to LEDs. For example, theelectronic components can be light-emitting bodies such as incandescentlamps. Here, other components such as integrated circuits may be mountedon the circuit board 90.

As shown in FIG. 3, the cooling device 1 has a heat sink 10. The heatsink 10 is arranged so as to be farther away from the circuit board 90than the heat-transferring member 20 in the thickness direction of thecircuit board 90 (direction Z1-Z2 in the Figure). In other words, theheat sink 10 is arranged on the other side of the interposedheat-transferring member 20 from the circuit board 90. In this example,the cooling device 1 has a plurality of heat sinks 10. These heat sinks10 are arranged away from the heat-transferring member 20 in thethickness direction of the circuit board 90. As a result, air can flowtowards the heat sinks 10 through the space between the heat sinks 10and the heat-transferring member 20. As mentioned above, the coolingdevice 1 used in the lighting device 100 has the heat-transferringmember 20 on the bottom end. As a result, the warm air inside the heatsinks 10 is directed upwards.

As shown in FIG. 3, the cooling device 1 in this example has four heatsinks 10. The four heat sinks 10 are arranged in the thickness directionof the circuit board 90 (that is, in the thickness direction of theheat-dissipating plates 21, or direction Z1-Z2). The two adjacent heatsinks 10 make contact with each other so that there is no space betweenthe four heat sinks 10. Space may also be formed between the four heatsinks 10. Moreover, the number of heat sinks 10 is not limited to four.

As shown in FIGS. 1-2, each heat sink 10 has a support portion 12 and aplurality of fins 13. The fins 13 in this example are wall-like and areerected on a plane parallel to the circuit board 90. Each fin 13 extendsin the direction of the circuit board 90. In this example, each fin 13extends linearly in a direction parallel to the circuit board 90.

A space is formed between each of the plurality of fins 13, and thesupport portion 12 extends in the arrangement direction of the fins 13and is connected to them. In this way, the plurality of fins 13 aresupported by the support portion 12. Like the fins 13, the supportportion 12 is wall-like and is erected on a plane parallel to thecircuit board 90. In other words, the support portion 12 is wall-likeand has vertical lines that are parallel to the circuit board 90. Eachof the fins 13 projects from the side face of the support portion 12,and is formed orthogonally with respect to the support portion 12.

As explained below and as shown in FIGS. 1-2, the support portion 12 inthis example has a portion extending in direction X1-X2, which isorthogonal with respect to the thickness direction of the circuit board90 (direction Z1-Z2), and a portion extending in direction Y1-Y2, whichis orthogonal to direction Z1-Z2 and direction X1-X2. For example, thesupport portion 12 of the uppermost heat sink 10 has a first extendedportion 12 a extending in direction X1-X2, and second extended portions12 b, 12 c extending in direction Y1-Y2. A plurality of fins 13 isformed in each of the extended portions 12 a-12 c. Therefore, each heatsink 10 includes fins 13 extending in direction X1-X2 and fins 13extending in direction Y1-Y2. The fins 13 are formed so that the entireheat sink 10 has a circular shape. The shape of the heat sinks 10 is notlimited to a circular shape. They may also be rectangular. The four heatsinks 10 have the same shape. As explained below, two adjacent heatsinks 10 are arranged at a 90° angle with respect to each other in thecircumferential direction with reference to the centerline C1.

As shown in FIG. 2, the cooling device 1 has heat-transferring columnsfor transferring heat. The cooling device 1 has a plurality ofheat-transferring columns, and these are arranged apart from each other.The heat-transferring columns in the example explained here are heatpipes 31. The heat-transferring columns do not have to be heat pipes.The heat-transferring columns can be any column-shaped member made of athermally conductive material such as copper or aluminum.

As shown in FIG. 2, each heat pipe 31 is connected to theheat-transferring member 20. In this example, the heat-transferringmember 20 has a plurality of sockets 22 each of which is attached to aheat-dissipating plate 21. The heat pipes 31 are connected thermally tothe heat-dissipating plates 21 via these sockets 22. More specifically,each socket 22 is a hole formed at a position corresponding to a heatpipe 31. The end portion of each heat pipe 31 is inserted into a hole.The end portion of the heat pipe 31 is mounted in the socket 22 usingsolder or an adhesive, or is forcibly inserted. The sockets 22 areattached to heat-dissipating plates 21 using, for example, screws. Thesockets 22 may also be attached to heat-dissipating plates 21 usingsolder or an adhesive.

As shown in FIG. 2, the sockets 22 in this example are frame-shaped witha hole 22 a formed on the inside. Also, each socket 22 has protrudingportions 22 b positioned away from each other, and a hole is formed ineach protruding portion 22 b for the insertion of a heat pipe 31. Inother words, there is a recessed portion between two protruding portions22 b for the mounting of two heat pipes 31. I n this way, air can flowto the heat sinks 10 via the recess between the two protruding portions22 b. In this example, the sockets 22 are rectangular, and sized inaccordance with the heat-dissipating plates 21. Protruding portions 22 bare formed on the four sides of the sockets 22. The sockets 22 may alsobe integrally molded with the heat-dissipating plates 21.

As shown in FIG. 2, each heat pipe 31 extends in the thickness directionof the circuit board 90 and is connected to the support portion 12 forfour heat sinks 10. In other words, each heat pipe 31 is connected tothe support portion 12 for four heat sinks 10. In this way, heat fromthe LEDs 91 is transmitted to the support portion 12 via theheat-dissipating plates 21, the sockets 22, and the heat pipes 31. Inother words, the heat from the LEDs 91 is distributed to four heat sinks10. The heat is then transferred to the fins 13 via the support portion12.

In this example, as shown in FIG. 4, a connecting hole H is formed inthe support portion 12 through each heat sink 10 in the thicknessdirection of the circuit board 90, and a heat pipe 31 is passed througheach connecting hole H. In FIG. 4, numbers 1-4 are appended to Hdenoting connecting holes. Here H1 through H4 are used to indicatespecific connecting holes. In other situations, the connecting holes aredenoted simply by the letter H. The heat pipes 31 are fixed to thesupport portion 12 using solder, an adhesive, or forcible insertion. Theheat pipes 31 are tube-shaped members that are closed at both ends toseal a coolant inside. In this example, the heat pipes 31 are linear.These are easier to manufacture and cost less than bent heat pipes.

As shown in FIG. 4, each heat sink 10 includes two separate heat sinkhalf bodies 11. These heat sink half bodies 11 are referred to below asheat sink half bodies. Each heat sink half body 11 has the supportbodies 12 and fins 13 described above. Two heat sink half bodies 11constituting a single heat sink 10 are arranged on the same plane. Inother words, the two heat sink half bodies 11 are positioned at the samedistance from the heat-transferring member 20. An air passage S isformed between the two heat sink half bodies 11 which extends in thedirection of the plane on which the half portions are arranged (in thedirection of the circuit board 90) and is linked to the outside of theheat sinks 10. In other words, a space is formed between the two heatsink half bodies 11, and this space functions as the air passage S. Inthis way, air F can be sent into heat sink 10 via the air passage S.

In this example, the heat sinks 10 are divided into two heat sink halfbodies 11. In other words, as shown in FIG. 4, the two heat sink halfbodies 11 are not linked. As a result, both ends of the two air passagesS are open to the outside of the heat sink 10. In this way, air can beefficiently sent to the various portions of the heat sink 10. Also, theair passages S travel along the centerline C1 of the heat sink 10extending in the thickness direction of the circuit board 90. As aresult, air can be sent to the portions of the heat sink 10 near thecenterline C1.

In this example, the eight heat sink half bodies 11 constituting thefour heat sinks 10 have the same shape. This improves the manufacturingproductivity of the heat sinks 10. Because the two heat sink half bodies11 constituting a single heat sink 10 are divided, the heat sink 10 iseasy to manufacture even when the heat sink is large. The two heat sinkhalf bodies 11 constituting a single heat sink 10 are arrangedsymmetrically along the centerline C1 and a line orthogonal to thecenterline C1. Each heat sink half body 11 is an integrally moldedmember. The heat sink half bodies 11 can be extrusion molded or cast inthe thickness direction of the circuit board 90.

The four heat sinks 10 are offset in the circumferential direction withrespect to adjacent heat sinks 10 and are centered on the centerline C1.In this example, as shown in FIGS. 1-2, two adjacent heat sinks 10 arearranged at 90° angles to each other in the circumferential directionwith respect to the centerline C1. As a result, the air flowing upwardfrom the heat-transferring member 20 is easily distributed to eachportion of the fins 13, and the cooling performance can be improved. Inthis example, an air passage S is formed between the two heat sink halfbodies 11 constituting a single heat sink 10. Because the two adjacentheat sinks 10 are offset in the circumferential direction, the airpassages S do not overlap in the thickness direction of the circuitboard 90. As a result, the air flowing into an air passage S is alsosupplied to the fins 13 of the adjacent heat sink 10, and the fins 13can be cooled more efficiently. The offset angle of the heat sinks 10 isnot limited to 90°. For example, the offset angle can be 45° or 120° asdescribed below. The angle can be altered based on the structure of theheat sink half bodies 11.

As mentioned above, a plurality of connecting holes H are formed in theheat sinks 10 for insertion of heat pipes 31. As shown in FIG. 4, thepositions of the connection holes H are laid out so as to berotationally symmetrical to the centerline C1. In other words, theconnecting holes H are positioned along a circle centered on thecenterline C1 at the offset angle of the two adjacent heat sinks 10 (90°in this example). In this way, the four heat sinks 10 can have the sameshape, and each heat pipe 31 can be connected to the four heat sinks 10.In this example and as shown in FIG. 4, the four connecting holes H1 arearranged on circle Cr1 at 90° intervals. Another four connecting holesH2 are arranged on circle Cr1 at 90° intervals. Connecting holes H3 andH4 are arranged on circle C2 which has a larger diameter than circle Cr1which includes connecting holes H1 and H2. Four connecting holes H3 arearranged at 90° intervals, and four connecting holes H4 are arranged at90° intervals. The support portion 12 is formed so as to pass throughthe positions of connecting holes H1-H4 (the positions of the heat pipes31). The heat sink half bodies 11 can be arranged at the desired angle,which is a multiple of 90°, in accordance with the layout of theconnecting holes H1-H4.

As shown in FIG. 1, the support portion 12 includes a first extendedportion 12 a. As mentioned above, in this example, two adjacent heatsinks 10 are arranged at a 90° angle with respect to each other in thecircumferential direction from the centerline C1. As a result, the firstextended portion 12 a in one heat sink 10 of the two heat sinks 10extends in the X1-X2 direction, and the first extended portion 12 a ofthe other heat sink 10 extends in the Y1-Y2 direction (see FIG. 2). Thefirst extended portion 12 a is a slender wall-shaped member erected on aplane parallel to the circuit board 90, and a line orthogonal to theextended portion is parallel to the circuit board 90.

As explained above, a single heat sink 10 has two heat sink half bodies11. As shown in FIG. 4, the first extended portions 12 a face each otherwith the centerline C1 interposed between them. A plurality of fins 13arranged in the extension direction of the first extended portion 12 aare formed on both side surfaces of the first extended portion 12 a. Theplurality of fins 13 extend from the first extended portion 12 a towardsthe heat sink half body 11 on the opposite side (the fins denoted by13-1 in FIGS. 1 and 4). The air passage S described above is formedbetween the fins 13-1 on one heat sink half body 11 and the fins 13-1 onthe other heat sink half body 11. In this structure, the fins 13-1 canbe cooled efficiently by air flowing through the air passage S.

Also, the support portion 12 has extended portions intersecting thefirst extended portion 12 a, and fins 13 are formed on these twoextended portions. In this example, as shown in FIG. 4, the supportportion 12 has a second extended portion 12 b intersecting the firstextended portion 12 a, and a third extended portion 12 c intersectingthe first extended portion 12 a. In this example, the second extendedportion 12 b and the third extended portion 12 c are orthogonal to thefirst extended portion 12 a.

As mentioned above, two adjacent heat sinks 10 are arranged at a 90°angle with respect to each other. Therefore, the second extended portion12 b and the third extended portion 12 c on one heat sink 10 of the twoadjacent heat sinks 10 extend in direction X1-X2, and the secondextended portion 12 b and the third extended portion 12 c on the otherheat sink 10 extend in direction Y1-Y2 (see FIG. 2).

As shown in FIGS. 1-2, the second extended portion 12 b extends in theopposite direction from the first extended portion 12 a. In other words,the second extended portion 12 b includes a portion extending towardsthe air passage S, and a portion extending in the opposite direction.Similarly, the third extended portion 12 c extends in the oppositedirection from the first extended portion 12 a. In other words, thethird extended portion 12 c includes a portion extending towards the airpassage S, and a portion extending in the opposite direction.

The support portion 12 in this example has two second extended portions12 b and two third extended portions 12 c. The two second extendedportions 12 b are formed symmetrically with respect to the center of thefirst extended portion 12 a. Similarly, the two third extended portions12 c are formed symmetrically with respect to the center of the firstextended portion 12 a. The two third extended portions 12 c are formedat the two ends of the first extended portion 12 a.

As shown in FIGS. 1-2, the second extended portions 12 b and the thirdextended portions 12 c, like the first extended portion 12 a, areslender wall-like members which are erected on a plane parallel to thecircuit board 90. A plurality of fins 13 extend from the side surface ofa second extended portion 12 b and are arranged in the direction ofextension. The fins 13 on the second extended portion 12 b extendopposite the fins 13 on the first extended portion 12 a. In a thirdextended portion 12 c, a plurality of fins 13 extend from the sidesurface of the third extended portion 12 c and are arranged in thedirection of extension. The fins 13 on the third extended portion 12 cextend opposite the fins 13 on the second extended portion 12 b.

As shown in FIG. 4, the second extended portions 12 b on the two heatsink half bodies 11 are not linked to each other. Instead, an airpassage S is formed between them. The third extended portions 12 c onthe two heat sink half bodies 11 are also not connected to each other.Here, too, an air passage S is formed between them. In this way, air cansmoothly pass between the fins 13-1 formed on the first extended portion12 a and the fins 13 formed on the second extended portion 12 b.

As shown in FIG. 4, two connecting holes H are formed some distance fromeach other in the first extended portion 12 a. Two connecting holes Hare also formed in the second extended portion 12 b, and these arearranged opposite those in the first extended portion 12 a with thefirst extended portion 12 a interposed in between. In addition,connecting holes H are formed in the third extended portion 12 c. Inthis way, connecting holes H are distributed throughout the supportportion 12. In this way, the cooling function of the heat sink 10 doesnot depend as much on the heat pipes 31.

As mentioned above, the heat-transferring member 20 includes fourheat-dissipating plates 21. In this example, the four heat-dissipatingplates 21 are arranged in two rows and two columns (see FIG. 5). Asshown in FIG. 1, a plurality of heat pipes 31 (eight in this example)connected to two adjacent heat-dissipating plates 21 are fixed to asingle heat sink half body 11. In other words, eight heat pipes 31 passthrough eight connecting holes H in each heat sink half body 11. In thisway, two adjacent heat-dissipating plates 21 can be connected via a heatsink half body 11. Also, as mentioned above, two adjacent heat sinks 10are arranged at a 90° angle with respect to each other in thecircumferential direction with reference to the centerline C1. As aresult, four heat-dissipating plates 21 are connected via a heat sink10.

The cooling device 1 can be assembled in the following manner. First,the end portions of heat pipes 31 are fixed to four heat-transferringmembers 20. In other words, the end portions of the heat pipes 31 areinserted into holes formed in the sockets 22 of the heat-transferringmembers 20. The ends of the heat pipes 31 are fixed to the sockets 22using soldering, an adhesive, or forced insertion. Fourheat-transferring members 20 are arranged in two rows and two columns.Afterwards, the plurality of heat pipes 31 are inserted into theplurality of connecting holes H in the first heat sink 10. The heat sink10 is then soldered or bonded to the heat pipes 31. Next, the secondheat sink 10 is rotated 90° with respect to the first heat sink 10, andinserted into the plurality of heat pipes 31. The second heat sink 10 isthen fixed to the heat pipes 31. The third heat sink 10 and the fourthheat sink 10 are inserted into the heat pipes 31 in the same manner.

As explained above, the cooling device 1 has a heat-transferring member20 mounted on one side of a circuit board 90, a panel-shapedheat-generating body, and has a heat sink 10 arranged closer to theheat-transferring member 20 than the circuit board 90 in the thicknessdirection of the circuit board 90. The heat sink 10 has a plurality offins 13 extending in the direction of the circuit board 90 with spaceformed between them. Also, the heat sink 10 includes a support portion12 which extends in the arrangement direction of the fins 13, and whichconnects to and supports the plurality of fins 13. The cooling device 1has a plurality of heat pipes 31 arranged at some distance from eachother and connected to a heat-transferring member 20. Each heat pipe 13extends in the thickness direction of the circuit board 90 and isconnected to the support portion 12. In this way, heat can betransferred efficiently to the heat sink 10.

FIGS. 6-7 illustrate a modified example of heat sinks The three heatsinks 110 shown in FIG. 6 are arranged opposite the circuit board withthe heat-transferring member 20 interposed between them. These arearranged in the thickness direction of the circuit board (direction Z inFIG. 6). As shown in FIG. 7, each heat sink 110 has a plurality of fins13 extending in the direction of the circuit board with space formedbetween them. Also, each heat sink 110 has a support portion 112extending in the arrangement direction of the plurality of fins 13 andconnected to them. Each heat sink 10 is composed of two half bodies(referred to as heat sink half portions A below), and each of the heatsink half portions A includes a support portion 112 and a plurality offins 13. Two support portions 112 extend from their shared end portionand an acute angle (specifically, a 60° angle) is formed between them.The heat sink half portions A include a plurality of fins 113 extendingtowards the inside of the two support portions 112, and a plurality offins 113 extending towards the outside of the two support portions 112.The fins 13 give the heat sink 110 a circular-shape overall. The twoheat sink half portions A are connected by the shared end portion of thesupport portions 112.

A plurality of connecting holes H are formed in the two support portions112 (three in this example). As in the cooling device 1, aheat-transferring column (for example, a heat pipe) is passed througheach connecting hole H. In this way, the support portions 112 of thethree heat sinks 110 are connected by a plurality of heat-transferringcolumns.

As shown in FIG. 7, an air passage S is formed between two heat sinkhalf portions A which extends in the thickness direction of the circuitboard and is linked to the outside of the heat sink 110. In this way,air can be sent to both heat sink half portions A via the air passage S.In this example, an air passage S is formed between fins 113 extendinginward from one support portion 112 and fins 113 extending inward fromanother support portion 112. In this way, air can be sent to the fins113.

As shown in FIG. 6, three heat sinks 110 are arranged so that twoadjacent heat sinks 110 are offset in the circumferential direction withrespect to the centerline C2. In this example, the two adjacent heatsinks 110 are offset 120° in the circumferential direction with respectto the centerline C2. As a result, the air passages S of two adjacentheat sinks 110 do not overlap in the thickness direction of the circuitboard.

As mentioned above, a plurality of connecting holes H are formed in thesupport portion 112 for the insertion of heat pipes. As shown in FIG. 7,the positions of the connecting holes H are rotationally symmetricalwith respect to the centerline C2. In other words, the connecting holesH are arranged on a circle centered on centerline C2 at the offset angleof two adjacent heat sinks 110 (120° in this example). Here, the threeheat sinks 110 have the same shape, and each heat pipe is connected tothe three heat sinks 110. In this example, connecting holes H are formedin the shared end of two support portions 112. Connecting holes H arealso formed at the same positions on the opposite side of the supportportions 112. In this way, three connecting holes H are positioned atthe vertices of an equilateral triangle. This concludes the explanationof the heat sinks 110.

In the cooling device 1, the heat sink half bodies 11 of the heat sinks10 all have the same shape. However, the heat sink half bodes 11 do nothave to have the same shape. For example, the two heat sink half bodiesconstituting a single heat sink 10 can have different shapes.

While a preferred embodiment of the Present Disclosure is shown anddescribed, it is envisioned that those skilled in the art may devisevarious modifications without departing from the spirit and scope of theforegoing Description and the appended Claims.

What is claimed is:
 1. A cooling device, the cooling device comprising:a heat-transferring member, the heat-transferring member being mountedon one side of a panel-shaped heat-generating body; a heat sink, theheat sink being arranged farther away from the heat-generating body thanthe heat-transferring member in the thickness direction of theheat-generating body, the heat sink including a plurality of fins and asupport portion, each fin extending in the direction of theheat-generating body and separated from each other by a space, thesupport portion extending in the direction of the fins and connecting toand supporting the fins; and a plurality of heat-transferring columns,each heat-transferring column being connected to the heat-transferringmember and separated from each other by a space, and extending in thethickness direction of the heat-generating body and connecting to thesupport portion.
 2. The cooling device of claim 1, further comprising aplurality of heat sinks
 3. The cooling device of claim 2, wherein eachheat sink is arranged in the thickness direction of the heat-generatingbody.
 4. The cooling device of claim 3, wherein each heat sink has thesame shape.
 5. The cooling device of claim 4, wherein each heat sink isoffset in the circumferential direction with respect to an adjacent heatsink.
 6. The cooling device of claim 5, wherein each heat sink iscentered on the centerline of the heat-generating body in the thicknessdirection.
 7. The cooling device of claim 6, wherein the support portionfor each heat sink includes a first extended portion extending in thedirection of the heat-generating body.
 8. The cooling device of claim 7,wherein the support portion for each heat sink further includes a secondextended portion extending in a direction intersecting the direction ofextension of the first extended portion.
 9. The cooling device of claim8, wherein a portion of the fins on each heat sink projects from thefirst extended portion.
 10. The cooling device of claim 9, wherein aportion of the fins on each heat sink projects from the second extendedportion.
 11. The cooling device of claim 10, wherein the second extendedportion includes at least two extended portions arranged symmetricallywith respect to the centerline of the first extended portion.
 12. Thecooling device of claim 11, wherein the plurality of eachheat-transferring columns comprises at least three heat-transferringcolumns.
 13. The cooling device of claim 12, wherein the support portioncomprises at least three connecting portions.
 14. The cooling device ofclaim 13, wherein each connecting portion is connected to oneheat-transferring column and arranged at equal intervals in thecircumferential direction centered on the centerline of theheat-generating body in the thickness direction.
 15. The cooling deviceof claim 14, wherein each heat sink includes a first half body and asecond half body.
 16. The cooling device of claim 15, wherein bothbodies including a support portion and a plurality of fins and beingarranged symmetrically with respect to a straight line running along theheat-generating body.
 17. The cooling device of claim 16, wherein an airpassage is formed between the first half body and the second half body.18. The cooling device of claim 17, wherein the air passage extendsradially from the centerline running through the heat-generating body inthe thickness direction.
 19. The cooling device of claim 18, wherein theair passage is linked to the outside of each heat sink.
 20. The coolingdevice of claim 19, wherein the fins in the first half body extend inthe direction of the second half body, the fins in the second half bodyextend in the direction of the first half body, and the air passage isformed between the fins of the first half body and the fins of thesecond half body.